Semiconductor device structure and method for forming the same

ABSTRACT

A semiconductor device structure is provided. The semiconductor device structure includes a first device formed over a substrate, and the first device includes a first fin structure. The semiconductor device structure also includes a second device formed over or below the first device, and the second device includes a plurality of second nanostructures stacked in a vertical direction.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/954,191 filed on Dec. 27, 2019, the entirety of which is incorporatedby reference herein.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment. Semiconductor devices are typically fabricated bysequentially depositing insulating or dielectric layers, conductivelayers, and semiconductive layers of material over a semiconductorsubstrate, and patterning the various material layers using lithographyto form circuit components and elements thereon. Many integratedcircuits are typically manufactured on a single semiconductor wafer, andindividual dies on the wafer are singulated by sawing between theintegrated circuits along a scribe line. The individual dies aretypically packaged separately, in multi-chip modules, for example, or inother types of packaging.

As the semiconductor industry has progressed into nanometer technologyprocess nodes in pursuit of higher device density, higher performance,and lower costs, challenges from both fabrication and design issues haveresulted in the development of three-dimensional designs.

Although existing semiconductor devices have generally been adequate fortheir intended purposes, they have not been entirely satisfactory in allrespects.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1Q show perspective representations of various stages offorming a semiconductor device structure, in accordance with someembodiments of the disclosure.

FIGS. 2A-2Q show perspective representations of various stages offorming a semiconductor device structure, in accordance with someembodiments of the disclosure.

FIGS. 3A-3Q show perspective representations of various stages offorming a semiconductor device structure, in accordance with someembodiments of the disclosure.

FIGS. 4A-4Q show perspective representations of various stages offorming a semiconductor device structure, in accordance with someembodiments of the disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Some variations of the embodiments are described. Throughout the variousviews and illustrative embodiments, like reference numbers are used todesignate like elements. It should be understood that additionaloperations can be provided before, during, and after the method, andsome of the operations described can be replaced or eliminated for otherembodiments of the method.

The nanostructure transistor, for example, gate all around (GAA)transistor structures described below may be patterned by any suitablemethod. For example, the structures may be patterned using one or morephotolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers may then be used to pattern the GAA device.

The present disclosure is related to semiconductor devices and methodsof forming the same. More particularly, the present disclosure isrelated to a nanostructure device integrated with a FinFET device. Ananostructure device, for example, gate-all-around (GAA), includes adevice that has its gate structure, or portions thereof, formed onfour-sides of a channel region (e.g., surrounding a portion of a channelregion). The channel region of a nanostructure device may includenanostructure channels, for example, nanowire channels, bar-shapedchannels, and/or other suitable channel configurations. In someembodiments, the channel region of a GAA device may have multiplehorizontal nanostructures (such as horizontal nanowires or horizontalbars) vertically spaced, making the GAA device a stacked horizontal GAA(S-HGAA) device. Further, the GAA devices may have one or morenanostructures channel regions (e.g. nanowires, nanosheets) associatedwith a single, contiguous gate structure, or multiple gate structures.One of ordinary skill may recognize other examples of semiconductordevices that may benefit from aspects of the present disclosure.

Embodiments for forming a semiconductor device structure 100 a areprovided. FIGS. 1A-1Q show perspective representations of various stagesof forming a semiconductor device structure 100 a, in accordance withsome embodiments of the disclosure. The semiconductor device structuremay include a static random access memory (SRAM) and/or logic circuits,passive components (such as resistors, capacitors, and inductors), andactive components (such as p-type field effect transistors (PFETs),n-type FETs (NFETs), multi-gate FETs), metal-oxide semiconductor fieldeffect transistors (MOSFETs), complementary metal-oxide semiconductor(CMOS) transistors, bipolar transistors, high voltage transistors, highfrequency transistors, other memory cells, and combinations thereof.

As shown in FIG. 1A, a substrate 110 is provided. The substrate 110 maybe made of silicon or other semiconductor materials. Alternatively oradditionally, the substrate 110 may include other elementarysemiconductor materials such as germanium. In some embodiments, thesubstrate 110 is made of a compound semiconductor such as siliconcarbide, gallium arsenic, indium arsenide, or indium phosphide. In someembodiments, the substrate 110 is made of an alloy semiconductor such assilicon germanium, silicon germanium carbide, gallium arsenic phosphide,or gallium indium phosphide. In some embodiments, the substrate 110includes an epitaxial layer. For example, the substrate 110 has anepitaxial layer overlying a bulk semiconductor.

A first sacrificial layer 120 is formed on the substrate 110. The firstsacrificial layer 120 may be epitaxially grown on the substrate 110,such that the first sacrificial layer 120 forms a crystalline layer. Insome embodiments, the first sacrificial layer 120 and the substrate 110have different materials and/or components, such that the firstsacrificial layer 120 and the substrate 110 have different etchingrates. In some embodiments, the first sacrificial layer 120 is made ofsilicon germanium (SiGe). The germanium percentage (atomic percentage)of the first sacrificial layer 120 is in a range between about 40percent and about 60 percent, while higher or lower germaniumpercentages may be used. It is noted that the values recited throughoutthe description are examples, and may be changed to different values. Insome embodiments, the thickness of the first sacrificial layer 120 is ina range between about 20 nm to about 100 nm.

A first semiconductor stack 130 is formed over the first sacrificiallayer 120. The first semiconductor stack 130 includes a first finstructure 132 and a semiconductor layer 134. The first fin structure 132is formed over the first sacrificial layer 120. In some embodiments, thefirst fin structure 132 is made of silicon (Si). In some embodiments,the first fin structure 132 is made of silicon that is free fromgermanium (Ge). In some embodiments, the first fin structure 132 issubstantially pure silicon layers, for example, with a germaniumpercentage lower than about 1 percent. Furthermore, the first finstructure 132 may be intrinsic, which are not doped with p-type andn-type impurities.

The semiconductor layer 134 is formed over the first fin structure 132.In some embodiments, the semiconductor layer 134 is made of SiGe layershaving a germanium percentage lower than the germanium percentage in thefirst sacrificial layer 120. In some embodiments, the germaniumpercentage of the semiconductor layer 134 is in a range between about 20percent and about 30 percent. Furthermore, a difference between thegermanium percentages of the first sacrificial layer 120 and thegermanium percentage of the semiconductor layer 134 may be greater thanabout 20 percent or higher. In some embodiments, the thickness of thesemiconductor layer 134 is in a range between about 10 nm and about 20nm.

A second sacrificial layer 140 is formed on the first semiconductorstack 130. The second sacrificial layer 140 may be epitaxially grown onthe first semiconductor stack 130, such that the second sacrificiallayer 140 forms a crystalline layer. In some embodiments, the secondsacrificial layer 140 and the substrate 110 have different materialsand/or components, such that the second sacrificial layer 140 and thesubstrate 110 have different etching rates. Furthermore, the secondsacrificial layer 140 and the first sacrificial layer 120 havesubstantially the same material and/or component, such that the secondsacrificial layer 140 and the first sacrificial layer 120 havesubstantially the same etching rate. In some embodiments, the secondsacrificial layer 140 is made of silicon germanium (SiGe). The germaniumpercentage (atomic percentage) of the second sacrificial layer 140 is ina range between about 40 percent and about 60 percent, while higher orlower germanium percentages may be used. It is noted that the valuesrecited throughout the description are examples, and may be changed todifferent values. In some embodiments, the thickness of the secondsacrificial layer 140 is in a range between about 20 nm to about 100 nm.

A second semiconductor stack 150 is formed over the second sacrificiallayer 140 through epitaxy, such that the second semiconductor stack 150forms crystalline layers. The second semiconductor stack 150 includes anumber of semiconductor layers 152 and 154 stacked alternatively. Thesemiconductor layers 152 can be SiGe layers having a germaniumpercentage lower than the germanium percentage in the second sacrificiallayer 140. In some embodiments, the germanium percentage of thesemiconductor layers 152 is in a range between about 20 percent andabout 30 percent. Furthermore, a difference between the germaniumpercentage of the second sacrificial layer 140 and the germaniumpercentage of the semiconductor layers 152 may be greater than about 20percent or higher. In some embodiments, the thickness of each of thesemiconductor layers 152 is in a range between about 10 nm and about 20nm.

The semiconductor layers 154 may be pure silicon layers that are freefrom germanium. The semiconductor layers 154 may also be substantiallypure silicon layers, for example, with a germanium percentage lower thanabout 1 percent. Furthermore, the semiconductor layers 154 may beintrinsic, which are not doped with p-type and n-type impurities. Theremay be two, three, four, or more of the semiconductor layers 154. Insome embodiments, the thickness of each of the semiconductor layers 154is in a range between about 3 nm and about 10 nm. In some otherembodiments, however, the semiconductor layers 154 can be silicongermanium or germanium for p-type semiconductor device, or can be III-Vmaterials, such as InAs, InGaAs, InGaAsSb, GaAs, InPSb, or anothersuitable material.

A patterned hard mask 160 is formed over the second semiconductor stack150. In some embodiments, the patterned hard mask 160 is made of siliconnitride, silicon oxynitride, silicon carbide, silicon carbo-nitride, orthe like. The patterned hard mask 160 covers a portion of the secondsemiconductor stack 150 while leaves another portion of the secondsemiconductor stack 150 uncovered.

Afterwards, as shown in FIG. 1B, the substrate 110, the firstsacrificial layer 120, the first semiconductor stack 130, the secondsacrificial layer 140, and the second semiconductor stack 150 arepatterned by using the patterned hard mask 160 to form a semiconductorstrip 210, in accordance with some embodiments of the disclosure. As aresult, trenches 202 are formed. In some embodiments, the width W of thesemiconductor strip 210 is in a range of about 10 nm to about 100 nm.

Next, an insulating material is formed over the substrate 110 and overthe semiconductor strip 210. Next, a portion of the insulating materialis removed to form an isolation structure 220, in accordance with someembodiments. As a result, the top portion of the semiconductor strip 210is above the isolation structure 220.

In some embodiments, the insulating material is made of silicon oxide,silicon nitride, silicon oxynitride (SiON), another applicableinsulating material, or a combination thereof. In some embodiments, theinsulating material is formed by a LPCVD process, plasma enhanced CVD(PECVD) process, high density plasma CVD (HDP-CVD) process, high aspectratio process (HARP) process, flowable CVD (FCVD) process, atomic layerdeposition (ALD) process, another suitable method, or a combinationthereof.

A dummy dielectric layer 230 is conformally formed to cover thesemiconductor strip 210 and the top surface of the isolation layer 220.Afterwards, a portion of the dummy dielectric layer 230 is removed. Thedummy dielectric layer 230 can be used to protect the semiconductorstrip 210 from being damaged by the subsequent processing (e.g.,subsequent formation of the dummy gate structure). In some embodiments,the dummy dielectric layer 230 includes silicon dioxide, siliconnitride, a high-k dielectric material or another suitable material. Insome embodiments, the dummy dielectric layer 230 is deposited by an ALDprocess, a CVD process, a subatmospheric CVD (SACVD) process, a flowableCVD process, a PVD process, or another suitable process.

Afterwards, as shown in FIG. 1C, a first dummy gate layer 310 is formedon the isolation structure 220 and at least on opposite sides of thesemiconductor strip 210.

In some embodiments, the first dummy gate layer 310 includespolycrystalline silicon (polysilicon). In some embodiments, the firstdummy gate layer 310 is formed by various process operations such asdeposition, planarazation, etching, as well as other suitable processingoperations. The deposition processes includes CVD (including bothlow-pressure CVD and plasma-enhanced CVD), PVD, ALD, thermal oxidation,e-beam evaporation, another suitable deposition technique, or acombination thereof. A planarization process, such as a chemicalmechanical planarization (CMP) process, may then be performed to exposethe top surface of the dummy dielectric layer 230. The CMP process mayremove portions of the first dummy gate layer 310 overlying thesemiconductor strip 210 and may planarize the top surface of thestructure. Then, an etching back process is performed to reduce thethickness of the first dummy gate layer 310 until the top surface of thefirst dummy gate layer 310 is substantially leveled with the topsurface, the bottom surface, or intermediate level of the secondsacrificial layer 140. In some embodiments, the etching process includesdry etching (e.g., RIE etching), wet etching, and/or other etchingmethods.

An etch stop layer 320 is formed on the first dummy gate layer 310. Insome embodiments, the top surface of the etch stop layer 320 issubstantially leveled with the top surface of the second sacrificiallayer 240. In some embodiments, the etch stop layer 320 is made ofsilicon dioxide. In some embodiments, the etch stop layer 320 is formedby implanting the oxygen ions into portions of the first dummy gatelayer 310 beneath the top surface of the first dummy gate layer 310, andperforming a thermal operation (such as a thermal operation) to annealthe first dummy gate layer 310. Therefore, a reaction occurs between theimplanted oxygen and the surrounding the first dummy gate layer 310 toprovide the etch stop layer 320 on the first dummy gate layer 310. Thatis, the etch stop layer 320 can be made of silicon dioxide. In someembodiments, the anneal process is a rapid thermal annealing (RTA)process, laser spike annealing (LSA) process, or another suitableannealing process. In some other embodiments, the etch stop layer 320 ismade of dielectric materials such as oxide, SiN, SiOCN, and is formed bya deposition and then etching back process.

A second dummy gate layer 330 is formed on the etch stop layer 320 andcovers the semiconductor strip 210. In some embodiments, the seconddummy gate layer 330 includes polycrystalline silicon (polysilicon). Insome embodiments, the second dummy gate layer 330 is formed by variousprocess operations, such as deposition, planarization, as well as othersuitable processing operations. The deposition processes includes CVD(including both low-pressure CVD and plasma-enhanced CVD), PVD, ALD,thermal oxidation, e-beam evaporation, or another suitable depositiontechnique, or a combination thereof. A planarization process, such as aCMP process, may then be performed. The CMP process may remove portionsof the first dummy gate layer 310 and may planarize the top surface ofthe structure.

A patterned hard mask 340 is formed over the second dummy gate layer330. In some embodiments, the patterned hard mask 340 is made of siliconnitride, silicon oxynitride, silicon carbide, silicon carbo-nitride, orthe like. The patterned hard mask 340 covers a portion of the seconddummy gate layer 330 while leaves another portion of the second dummygate layer 330 uncovered.

Afterwards, as shown in FIG. 1D, the first dummy gate layer 310, theetch stop layer 320 and the second dummy gate layer 330 are patterned byusing the patterned hard mask 340 as a mask to form at least one dummygate stack 410 crossing the semiconductor strip 210, in accordance withsome embodiments of the disclosure.

The dummy gate stack 410 covers a portion of the semiconductor strip 210and leaves other portions of the semiconductor strip 210 uncovered. Theportion of the semiconductor strip 210 covered by the dummy gate stack410 can be referred to as a channel region of the semiconductor strip210, and the portions of the semiconductor strip 210 uncovered by thedummy gate stack 410 can be referred to as source/drain regions of thesemiconductor strip 210. In some embodiments, the length L of the dummygate stack 410 is in a range of about 5 nm to about 500 nm.

A number of gate spacers 420 are respectively formed on sidewalls of thedummy gate stack 410. The gate spacers 420 may include a seal spacer anda main spacer (not shown). The gate spacers 420 include one or moredielectric materials, such as silicon oxide, silicon nitride, siliconoxynitride, SiCN, SiCxOyNz, or a combination thereof. The gate spacers420 can be formed by using a deposition method, such as plasma enhancedchemical vapor deposition (PECVD), low-pressure chemical vapordeposition (LPCVD), sub-atmospheric chemical vapor deposition (SACVD),or the like. The formation of the gate spacers 420 may include blanketforming spacer layers, and then performing etching operations to removethe horizontal portions of the spacer layers. The remaining verticalportions of the gate spacer layers form the gate spacers 420.

Afterwards, as shown in FIG. 1E, a portion of the semiconductor strip210 and the dummy dielectric layer 230 uncovered by the dummy gate stack410 and the gate spacers 420 are removed, in accordance with someembodiments of the disclosure. As such, the channel portion of thesemiconductor strip 210 and the top surface of the substrate 110 areexposed. In some embodiments, the semiconductor strip 210 and the dummydielectric layer 230 are etched by using the dummy gate stack 410 andthe gate spacers 420 as an etching mask. The etching process includes adry etching process, a wet etching process, or a combination thereof.

An insulation layer 510 is formed on the top surface of the substrate110. In some embodiments, the insulating layer 510 is made of silicondioxide, dielectric materials, or other applicable materials. In someembodiments, oxygen ions are implanted into portions of the substrate110 beneath the top surface of the substrate 110, and a thermaloperation (such as a thermal operation) to anneal the substrate 110.Therefore, a reaction occurs between the implanted oxygen and thesurrounding substrate 110 to provide the insulation layer 510 on thesubstrate 110. That is, the insulating layer 510 can be made of silicondioxide. In some embodiments, the anneal process includes a rapidthermal annealing (RTA) process, laser spike annealing (LSA) process, oranother suitable annealing process. In some other embodiments, theinsulating layer 510 is made of dielectric materials, and formed by adeposition and then etching back process. In some embodiments, thethickness of the insulating layer 510 is in a range of about 20 nm toabout 100 nm.

Afterwards, as shown in FIG. 1F, the first sacrificial layer 120 and thesecond sacrificial layer 140 are removed, in accordance with someembodiments of the disclosure. As a result, an opening 122 is formedbetween the first semiconductor stack 130 and the substrate 110, and anopening 142 is formed between the second semiconductor stack 150 and thefirst semiconductor stack 130.

In some embodiments, the first sacrificial layer 120 and the secondsacrificial layer 140 are removed by performing an etching process. Insome embodiments, the etching process can be a wet etch process whichhas high etching selectivity between germanium and silicon. Since thematerials of the first sacrificial layer 120 and the second sacrificiallayer 140 are different from the first semiconductor stack 130 and thesecond semiconductor stack 150, etching rates thereof are different, andthe first semiconductor stack 130 and the second semiconductor stack 150remain in place while the first sacrificial layer 120 and the secondsacrificial layer 140 are removed.

A first inner gate spacer 610 is formed in the opening 122 and betweenthe first semiconductor stack 130 and the substrate 110, and a secondinner gate spacer 620 is formed in the opening 142 and between thesecond semiconductor stack 150 and the first semiconductor stack 130. Insome other embodiments, the second inner gate spacer 620 is not formedbut the first inner gate spacer 610 is formed. In some embodiments, thetop surface of the inner gate spacer 610 is higher than the top surfaceof the isolation structure 220. In some embodiments, the top surface ofinner gate spacer 610 is higher than the top surface of the insulatinglayer 510.

The first inner gate spacer 610 and the second inner gate spacer 620 maybe made of silicon nitride, oxide, metal oxide, or other dielectric suchas SiCxOyNz. In some embodiments, the first inner gate spacer 610 andthe second inner gate spacer 620 are formed by performing an ALD processor another suitable process. In some embodiments, a trimming process isperformed after the first inner gate spacer 610 and the second innergate spacer 620 are deposited to remove portions of the first inner gatespacer 610 and the second inner gate spacer 620 outside the openings 122and 142.

Afterwards, as shown in FIGS. 1G-1 and 1G-2, the semiconductor layer 134and the semiconductor layers 152 are trimmed to form a number of firstsidewall spacers 710 on opposite sides of the semiconductor layer 134,and a number of second sidewall spacers 720 on opposite sides of thesemiconductor layers 152, in accordance with some embodiments of thedisclosure. FIG. 1G-2 shows a cross-sectional view taking along lineA-A′ of FIG. 1G-1.

In some embodiments, the semiconductor layer 134 and the semiconductorlayers 152 are removed by performing an etching process. In someembodiments, the etching process is a wet etch process which has highetching selectivity between germanium and silicon. Since the materialsof the semiconductor layer 134 and semiconductor layers 152 aredifferent from the first fin structure 132 and the semiconductor layers154, etching rates thereof are different, and the first fin structure132 and the semiconductor layers 154 remain in place while portions ofthe semiconductor layer 134 and the semiconductor layers 152 aretrimmed.

In some embodiments, the first sidewall spacers 710 and the secondsidewall spacers 720 are respectively made of silicon nitride, oxide,metal oxide, or other dielectric such as SiCxOyNz. In some embodiments,the first sidewall spacers 710 and the second sidewall spacers 720 areformed by an ALD process or another applicable process. In someembodiments, a trimming process is performed after the first sidewallspacers 710 and the second sidewall spacers 720 are deposited in orderto remove portions of the first sidewall spacers 710 and the secondsidewall spacers 720 external to the gate spacers 420.

Afterwards, as shown in FIGS. 1H-1 and 1H-2, a number of first epitaxystructures 810 are formed on opposite sidewalls of the first finstructure 132 and the semiconductor layers 154, in accordance with someembodiments of the disclosure. FIG. 1H-2 shows a cross-sectional viewtaking along line A-A′ of FIG. 1H-1. In addition, the second sidewallspacers 720 are between two adjacent semiconductor layers 154.

It should be noted that since the first epitaxy structures 810 are notin direct contact with the outer sidewall of the second sidewall spacers720, and therefore there is an air space 811 between the first epitaxystructures 810 and the second sidewall spacers 720. In some embodiments,the first epitaxy structures 810 is in direct contact with the outersidewall of the first fin structure 132. The interface between the firstepitaxy structures 810 and the first fin structure 132 is substantiallyaligned with the outer sidewall of the first sidewall spacer 710.

In some embodiments, the first epitaxy structures 810 are formed byperforming a selectively growing process. Therefore, the first epitaxystructures 810 are in contact with the first fin structure 132. Thefirst epitaxy structures 810 are formed by epitaxially growing asemiconductor material. The semiconductor material includes singleelement semiconductor material such as germanium (Ge) or silicon (Si);or compound semiconductor materials, such as gallium arsenide (GaAs),aluminum gallium arsenide (AlGaAs); or semiconductor alloy, such assilicon germanium (SiGe), gallium arsenide phosphide (GaAsP). The firstepitaxy structures 810 have suitable crystallographic orientations(e.g., a (100), (110), or (111) crystallographic orientation). In someembodiments, the first epitaxy structures 810 include source/drainepitaxial structures. In some embodiments, where a PFET device isdesired, the first epitaxy structures 810 may include an epitaxiallygrowing silicon germanium (SiGe). The epitaxial processes include CVDdeposition techniques (e.g., vapor-phase epitaxy (VPE) and/or ultra-highvacuum CVD (UHV-CVD)), molecular beam epitaxy, and/or another suitableprocess.

In some embodiments, the germanium concentration is tuned if the firstepitaxy structures 810 are made of silicon germanium. In someembodiments, the first epitaxy structures 810 is doped, for example,boron-doped, and the dopant concentration can be tuned. The sizes and/orthe shapes of the first epitaxy structures 810 can be tuned. In someembodiments, the first epitaxy structures 810 can be cube-shaped asshown in FIG. 1H-1, or be diamond shaped in some other embodiments.

Afterwards, as shown in FIGS. 1I-1 and 1I-2, a bottom interlayerdielectric (ILD) 910 is formed on the isolation structures 220, theinsulation layer 510, and at least on opposite sides of the dummy gatestack 410, in accordance with some embodiments of the disclosure. FIG.1I-2 shows a cross-sectional view taking along line A-A′ of FIG. 1I-1.The bottom ILD 910 surrounds the first epitaxy structures 810 in contactwith the first fin structure 132 and exposes the first epitaxystructures 810 in contact with the semiconductor layers 154.

In some embodiments, the bottom ILD 910 includes amorphous silicon(a-Si) or amorphous germanium (a-Ge). In some embodiments, the bottomILD 910 is formed by various process operations, such as deposition,planarazation, etching, as well as other suitable processing operations.The deposition processes includes CVD, PVD, ALD, thermal oxidation,e-beam evaporation, another suitable deposition technique, or acombination thereof. A planarization process, such as a CMP process, maythen be performed to expose the top surface of the patterned hard mask340. The CMP process may remove portions of the bottom ILD 910 overlyingthe patterned hard mask 340 and may planarize the top surface of thestructure. Then, an etch back process is performed to reduce thethickness of the bottom ILD 910 until the top surface of the bottom ILD910 is substantially leveled with the top surface, the bottom surface,or intermediate level of the second inner gate spacer 620. In someembodiments, the etching process includes dry etching (e.g., RIEetching), wet etching, and/or other etching methods.

It should be noted that, during the bottom ILD 910 is etched back, thefirst epitaxy structures 810 in contact with the semiconductor layers154 is also be removed. As such, the semiconductor layers 154 and thesecond sidewall spacers 720 are exposed.

Subsequently, an etch stop layer 920 is formed on the bottom ILD 910. Insome embodiments, oxygen ions are implanted into portions of the bottomILD 910 beneath the top surface of the bottom ILD 910, and a thermaloperation (such as a thermal operation) is performed to anneal thebottom ILD 910. Therefore, a reaction between the implanted oxygen andthe surrounding the bottom ILD 910 to provide the etch stop layer 920 onthe bottom ILD 910. That is, the etch stop layer 920 can be made ofsilicon dioxide. In some embodiments, the anneal process includes arapid thermal annealing (RTA) process, laser spike annealing (LSA)process, or another suitable annealing process. In some otherembodiments, the etch stop layer 920 is made of dielectric materialssuch as oxide, SiN, SiOCN, and is formed by a deposition and thenetching back process.

A number of second epitaxy structures 930 are formed on oppositesidewalls of the semiconductor layers 154 by performing, for example, aselectively growing process. Therefore, the second epitaxy structures930 are in direct contact with the semiconductor layers 154 andseparated from the first epitaxy structures 810. The second epitaxystructures 930 are formed by epitaxially growing a semiconductormaterial. The semiconductor material includes single elementsemiconductor material such as germanium (Ge) or silicon (Si); orcompound semiconductor materials, such as gallium arsenide (GaAs),aluminum gallium arsenide (AlGaAs); or semiconductor alloy, such assilicon germanium (SiGe), gallium arsenide phosphide (GaAsP). The secondepitaxy structures 930 have suitable crystallographic orientations(e.g., a (100), (110), or (111) crystallographic orientation). In someembodiments, the second epitaxy structures 930 include source/drainepitaxial structures. In some embodiments, where an NFET device isdesired, the second epitaxy structures 930 may include an epitaxiallygrowing silicon phosphorus (SiP) or silicon carbon (SiC). The epitaxialprocesses include CVD deposition techniques (e.g., vapor-phase epitaxy(VPE) and/or ultra-high vacuum CVD (UHV-CVD)), molecular beam epitaxy,and/or another suitable process.

In some embodiments, the second epitaxy structures 930 is doped, forexample, P-doped or As-doped, and the dopant concentration can be tuned.The sizes and/or the shapes of the second epitaxy structures 930 can betuned. For example, the second epitaxy structures 930 can be cube-shapedas shown in FIG. 1I-1, or be diamond shaped in some other embodiments.

In some embodiments, the first epitaxy structures 810 are p-type epitaxystructures, and the second epitaxy structures 930 are n-type epitaxystructures. In some other embodiments, the first epitaxy structures 810can be n-type epitaxy structures, and the second epitaxy structures 930can be p-type epitaxy structures. Embodiments fall within the presentdisclosure if the first epitaxy structures 810 and the second epitaxystructures 930 are different types or the same type of epitaxystructures. The first epitaxy structures 810 and the second epitaxystructures 930 are formed by different steps, and therefore the firstepitaxy structures 810 and the second epitaxy structures 930 can havedifferent types.

Afterwards, as shown in FIG. 1J, a top ILD 1010 is formed on the etchstop layer 920 and at least on opposite sides of the dummy gate stack410, in accordance with some embodiments of the disclosure.

In some embodiments, the top ILD 1010 includes materials different fromthe bottom ILD 910. In some embodiments, the top ILD 1010 is made ofdielectric materials, such as an oxide layer. In some embodiments, thetop ILD 1010 is formed by various process operations such as deposition,planarization, as well as other suitable processing operations. Thedeposition processes includes Flowable Chemical Vapor Deposition (FCVD),low-pressure CVD, plasma-enhanced CVD, PVD, ALD, thermal oxidation,e-beam evaporation, another suitable deposition technique, or acombination thereof. A planarization process, such as a CMP process, maythen be performed to expose the top surface of the second dummy gatelayer 330. The CMP process may remove portions of the top ILD 1010 andthe patterned hard mask 340 overlying the second dummy gate layer 330and may planarize the top surface of the structure.

Afterwards, as shown in FIGS. 1K-1 and 1K-2, a patterned hard mask 1110is formed over the second dummy gate layer 330, the gate spacers 420,and the top ILD 1010, in accordance with some embodiments of thedisclosure. FIG. 1K-2 is a cross-sectional view taking along line B-B′of FIG. 1K-1.

In some embodiments, the patterned hard mask 1110 is made of siliconnitride, silicon oxynitride, silicon carbide, silicon carbo-nitride, orthe like. The patterned hard mask 1110 covers portions of the seconddummy gate layer 330, the gate spacers 420, and the top ILD 1010 whileleaves other portions of the second dummy gate layer 330, the gatespacers 420, and the top ILD 1010 uncovered. Specifically, the patternedhard mask 1110 covers the first epitaxy structures 810, the secondepitaxy structures 930, and the semiconductor stacks 130 and 150.

The second dummy gate layer 330 and the etch stop layer 320 arepatterned by using the patterned hard mask 1110 as a mask to form atleast one trench 1120 between the gate spacers 420. Therefore, thetrench 1120 exposes the first dummy gate layer 310. However, the trench1120 does not expose the dummy dielectric layer 230. It should be notedthat the size of the trench 1120 is controlled by control the size ofthe patterned hard mask 1110.

A third inner gate spacer 1130 is formed at least on sidewalls of thesecond dummy gate layer 330 and the etch stop layer 320 exposed by thetrench 1120. In some embodiments, the third inner gate spacers 1130 areformed by the following steps. A dielectric layer is firstly conformallyformed on the exposed surfaces of the trench 1120, and then an etchingprocess, such as a dry etching process, is performed to remove portionsof the dielectric layer to form the third inner gate spacer 1130 on thesidewalls of the second dummy gate layer 330 and the etch stop layer320. Furthermore, the third inner gate spacer 1130 may be formed on thesidewall of the patterned mask layer 1110. In some embodiments, thethird inner gate spacer 1130 is made of SiN, oxide, metal oxide, orother dielectric such as SiCxOyNz. In some embodiments, the third innergate spacer 1130 is formed by performing an ALD process or anothersuitable process.

Afterwards, as shown in FIGS. 1L-1 and 1L-2, the remaining first dummygate layer 310, a portion of the dummy dielectric layer 230, and thesemiconductor layer 134 are removed to form a recess 1210, in accordancewith some embodiments of the disclosure. FIG. 1L-2 is a cross-sectionalview taking along line B-B′ of FIG. 1L-1. A first gate stack 1220 isformed and/or filled in the recess 1210. Therefore, the first gate stack1220 encircles (wraps) the first fin structure 132.

It should be noted that the first gate stack 1220 includes a firstportion and a second portion. The first portion is next to sidewall ofthe second gate stack 1320 (FIG. 1M-2), and the second portion isdirectly below the second gate stack 1320. In some embodiments, thefirst gate stack 1220 has a L-shaped structure.

In some embodiments, a first etching process is performed to remove theremaining first dummy gate layer 310, and the portion of the dummydielectric layer 230 is exposed. A second etching process is thenperformed to remove the exposed dummy dielectric layer 230, and thefirst fin structure 132 and the semiconductor layer 134 are exposed. Athird etching process is performed to selectively remove thesemiconductor layer 134 but not the first fin structure 132. Therefore,the first fin structure 132 is formed on the first inner gate spacer610.

After the removal of the semiconductor layer 134, the recess 1210 isdefined by the isolation structures 220, the first inner gate spacer610, the etch stop layer 320, the second inner gate spacer 620, thethird inner gate spacer 1130, and the gate spacers 420.

The gate spacers 420 are disposed on opposite sides of the first gatestack 1220. The first gate stack 1220 includes a high-k gate dielectriclayer 1220 a, a work function metal layer 1220 b, and a gate electrode1220 c. The high-k gate dielectric layer 1220 a is conformally formed inthe recess 1210. Therefore, the high-k gate dielectric layer 1220 a isin contact with the isolation structures 220, the first inner gatespacer 610, the etch stop layer 320, the second inner gate spacer 620,the third inner gate spacer 1130, the gate spacers 420, and thesemiconductor layer 134.

Furthermore, the high-k gate dielectric layer 1220 a surrounds the firstfin structure 132. In some embodiments, the high-k gate dielectric layer1220 a includes a material such as hafnium oxide (HfO₂), zirconium oxide(ZrO₂) or lanthanum oxide (La₂O₃). In some embodiments, the high-k gatedielectric layer 1220 a may be formed by performing an ALD process oranother suitable process.

The work function metal layer 1220 b is conformally formed on the high-kgate dielectric layer, and the work function metal layer 1220 bsurrounds the semiconductor layer 134 in some embodiments. The workfunction metal layer 1220 b may include materials such as TiN, TaN,TiAlSi, TiSiN, TiAl, TaAl, or another suitable material. In someembodiments, the work function metal layer 1220 b may be formed byperforming an ALD process or another suitable process.

The gate electrode 1220 c fills the remaining space in the recess 1210.Therefore, the work function metal layer 1220 b is in contact with andbetween the high-k gate dielectric layer 1220 a and the gate electrode1220 c. The gate electrode 1220 c may include material such as tungstenor aluminum. After the deposition of the high-k gate dielectric layer1220 a, the work function metal layer 1220 b, and the gate electrode1220 c, a planarization process, such as a CMP process, may then beperformed to remove portions of the high-k gate dielectric layer 1220 a,the work function metal layer 1220 b, and the gate electrode 1220 coutside the recess 1210 to form the first gate stack 1220. In someembodiments, the first gate stack 1220 is a p-type metal gate stack.

Afterwards, as shown in FIGS. 1M-1 and 1M-2, the remaining second dummygate layer 330, the remaining dummy dielectric layer 230, and thesemiconductor layers 152 are removed to form a recess 1310, inaccordance with some embodiments of the disclosure. As a result, thesemiconductor layers 154 are exposed. FIG. 1M-2 is a cross-sectionalview taking along line B-B′ of FIG. 1M-1.

A second gate stack 1320 is formed and/or filled in the recess 1310.Therefore, the second gate stack 1320 encircles (wraps) thesemiconductor layers 154 and is formed over the first gate stack 1220.The gate spacers 420 are disposed on opposite sides of the second gatestack 1320.

Furthermore, the second gate stack 1320 wraps the semiconductor layers154 (or nanostructures 154), the second sidewall spacers 720 are betweenthe second gate stack 1320 and the second epitaxy structures 930 toprevent leakage between second gate stack 1320 and source/drain (S/D)regions.

In some embodiments, the remaining second dummy gate layer 330, theremaining dummy dielectric layer 230, and the semiconductor layers 152are removed by performing multiple etching processes. In someembodiments, a first etching process is performed to remove theremaining second dummy gate layer 330, and the remaining dummydielectric layer 230 is exposed. A second etching process is thenperformed to remove the exposed dummy dielectric layer 230, and thesemiconductor layers 152 and 154 are exposed. A third etching process isperformed to selectively remove the semiconductor layers 152 but not thesemiconductor layers 154. As such, the semiconductor layers 154 remain,are spaced apart from each other, and are suspended over the secondinner gate spacer 620.

In some embodiments, the thickness of the etch stop layer 320 can bethick enough to prevent the etch stop layer 320 from removing during thesecond etching process. After the removal of the semiconductor layers154, the recess 1310 is defined by the etch stop layer 320, the secondinner gate spacer 620, the third inner gate spacer 1130, and the gatespacers 420.

The second gate stack 1320 includes a high-k gate dielectric layer 1320a, a work function metal layer 1320 b, and a gate electrode 1320 c. Thehigh-k gate dielectric layer 1320 a is conformally formed in the recess1310. In addition, the high-k gate dielectric layer 1320 a is in contactwith the etch stop layer 320, the second inner gate spacer 620, thethird inner gate spacer 1130, the gate spacers 420, and thesemiconductor layers 154.

Furthermore, the high-k gate dielectric layer 1320 a surrounds thesemiconductor layers 154, and spaces between the semiconductor layers154 are still left after the deposition of the high-k gate dielectriclayer 1320 a. In some embodiments, the high-k gate dielectric layer 1320a includes a material such as hafnium oxide (HFO₂), zirconium oxide(ZrO₂) or lanthanum oxide (La₂O₃). In some embodiments, the high-k gatedielectric layer 1320 a may be formed by performing an ALD process oranother suitable process.

The work function metal layer 1320 b is conformally formed on the high-kgate dielectric layer, and the work function metal layer 1320 bsurrounds the semiconductor layers 154 in some embodiments. The workfunction metal layer 1320 b may include materials such as TiN, TaN,TiAlSi, TiSiN, TiAl, TaAl, or another suitable material. In someembodiments, the work function metal layer 1320 b may be formed byperforming an ALD process or another suitable process.

The gate electrode 1320 c fills the remaining space in the recess.Therefore, the work function metal layer 1320 b is in contact with andbetween the high-k gate dielectric layer 1320 a and the gate electrode1320 c. The gate electrode 1320 c may include material such as tungstenor aluminum. After the deposition of the high-k gate dielectric layer1320 a, the work function metal layer 1320 b, and the gate electrode1320 c, a planarization process, such as a chemical mechanicalplanarization (CMP) process, may then be performed to remove portions ofthe high-k gate dielectric layer 1320 a, the work function metal layer1320 b, and the gate electrode 1320 c outside the recess 1310 to formthe second gate stack 1320. In FIGS. 1M-1 and 1M-2, the second gatestack 1320 is an n-type gate stack.

As shown in FIGS. 1M-1 and 1M-2, the first gate stack 1220 is a p-typemetal gate stack, and the second gate stack 1320 is an n-type metal gatestack. In some other embodiments, the first gate stack 1220 is an n-typemetal gate stack, and the second gate stack 1320 is a p-type metal gatestack.

As shown in FIGS. 1M-1 and 1M-2, the first fin structure 132, the firstepitaxy structures 810, and the first gate stack 1220 form a firstdevice 10, such as a p-type FET (PFET). The semiconductor layers 154,the second epitaxy structures 930, and the second gate stack 1320 form asecond device 20, such as an n-type FET (NFET). The first device 10 is aFinFET device, and the second device 20 is horizontal-gate-all-around(HGAA) device. Therefore, the first device 10 and the second device 20are stacked on the substrate 110, and the first device 10 is disposedbetween the second device 20 and the substrate 110. The channels of thefirst device 10 (i.e., the first fin structure 132) is disposed betweenthe substrate 110 and the channels of the second device 20 (i.e., thesemiconductor layers 154). In some embodiments, one of the first device10 and the second device 20 is a logic circuit device, and the other isthe static random access memory (SRAM).

The first device 10 is separated from the second device 20 by the etchstop layer 320, the second inner gate spacer 620, and the third innergate spacer 1130. More specifically, the etch stop layer 320, the secondinner gate spacer 620, and the third inner gate spacer 1130 are disposedbetween and in contact with the first gate stack 1220 and the secondgate stack 1320. That is, the first gate stack 1220 is isolated from thesecond gate stack 1320. Furthermore, the second inner gate spacer 620 isdisposed between the first fin structure 132 and the semiconductorlayers 154. The second inner gate spacer 620 includes a top surface indirect contact with the second gate stack 1320 and a bottom surface indirect contact with the first gate stack 1220.

The second gate stack 1320 is disposed over the first gate stack 1220.More specifically, the thickness T1 of the first gate stack 1220 isgreater than the thickness T2 of the second gate stack 1320. The bottomsurface of the first gate stack 1220 is lower than the bottom surface ofthe second gate stack 1320. The topmost surface of the first gate stack1220 is higher than the bottom surface of the second gate stack 1320. Insome embodiments, the top surface 1222 of the first gate stack 1220 issubstantially coplanar with the top surface 1322 of the second gatestack 1320. The isolation structure 220 is disposed between the firstgate stack 1220 and the substrate 110, and the second gate stack 1320 isdisposed over the isolation structure 220 and is spaced from theisolation structure 220 by the first gate stack 1220.

Afterwards, as shown in FIG. 1N, the top ILD 1010 is patterned to form anumber of trenches 1410 on opposite sides of the first gate stack 1220,in accordance with some embodiments of the disclosure. A number ofcontact spacers 1420 are formed at least on sidewalls of the remainingtop ILD 1010 and the etch stop layer 920 exposed by the trenches 1410.

In some embodiments, a dielectric layer is conformally formed on theexposed surfaces of the trenches 1410, and then an etching process, suchas a dry etching process, is performed to remove portions of thedielectric layer to form the contact spacers 1420 on the sidewalls ofthe remaining top ILD 1010 and the etch stop layer 920. In someembodiments, the contact spacers 1420 are formed by SiN, oxide, metaloxide, or other dielectric such as SiCxOyNz. In some embodiments, thecontact spacers 1420 are formed by performing an ALD process or anothersuitable process.

Next, as shown in FIG. 1O, the remaining top ILD 1010 is recessed toform a number of trenches 1510 on opposite sides of the second gatestack 1320, in accordance with some embodiments of the disclosure. Thetrenches 1510 respectively expose at least portions of the secondepitaxy structures 930.

In some embodiments, the remaining top ILD 1010 is partially removed,such that a portion of the top ILD 1010 remains on the etch stop layer920 as shown in FIG. 1O. In some other embodiments, the remaining topILD 1010 is removed, such that the etch stop layer 920 is exposed by thetrenches 1510.

Afterwards, as shown in FIG. 1P, the remaining bottom ILD 910 is removedto from a number of recesses 1610 on opposite sides of the first gatestack 1220, in accordance with some embodiments of the disclosure. As aresult, the respective recesses 1610 expose the first epitaxy structures810, the isolation structures 220, and the insulation layers 510.

Afterwards, as shown in FIG. 1Q, the first epitaxy structures 810 andthe second epitaxy structures 930 undergo a silicide process to form afirst metal silicide layer 1705 surrounding the first epitaxy structures810 and a second metal silicide layer 1715 surrounding a portion of thesecond epitaxy structures 930, in accordance with some embodiments ofthe disclosure.

In some embodiments, the first metal silicide layer 1705 and the secondmetal silicide layer 1715 are formed by the following steps. A thinmetal layer (not shown) is firstly formed, and the substrate 110 is thenheated, which causes silicon and germanium to react with the metal wherecontacted. In some embodiments, the thin metal layer is made of nickel,platinum, palladium, vanadium, titanium, cobalt, tantalum, ytterbium,zirconium, and combinations thereof. After the reaction, the first metalsilicide layer 1705 is formed between the first epitaxy structure 810and the metal layer, and the second metal silicide layer 1715 is formedbetween the second epitaxy structures 930 and the metal layer. Theun-reacted metal layer is selectively removed through the use of anetchant that attacks metal but does not attack the first metal silicidelayer 1705 and the second metal silicide layer 1715.

After the silicide process, a number of first contacts 1710 arerespectively formed in the recesses 1610, and a number of secondcontacts 1720 are respectively formed in the trenches 1510 and over thefirst contacts 1710. Therefore, the first contacts 1710 are in contactwith and wrap the first metal silicide layer 1705 while the secondcontacts 1720 are in contact with and wrap the second metal silicidelayer 1715.

In some embodiments, the first contacts 1710 and the second contacts1720 are respectively made of metal, such as tungsten (W), cobalt (Co),ruthenium (Ru), aluminum (Al), copper (Cu), or another suitablematerial. After the deposition of the first contacts 1710 and the secondcontacts 1720, a planarization process, such as a chemical mechanicalplanarization (CMP) process, may then be performed. Therefore, the topsurface of the first contact 1710 and the top surface of the secondcontact 1720 are coplanar.

The first contact 1710 is separated from the second contact 1720 by theetch stop layer 920, the top ILD 1010, and the contact spacer 1420. Morespecifically, the etch stop layer 920, the top ILD 1010, and the contactspacer 1420 are disposed between and in contact with the first contact1710 and the second contact 1720. That is, the first contact 1710 isisolated from the second contact 1720. Furthermore, the etch stop layer920 is disposed between the first epitaxy structure 810 and the secondepitaxy structure 930.

In the first embodiment, the first device 10, such as a p-type FET(PFET) is formed over the substrate 110, and the second device 20, suchas n-type FET (NFET) is formed over the first device 10. In someembodiments, the first device 10 includes a first fin structure havingSi as a channel, and the second device includes a number ofnanostructures (nanowires, nanosheets, etc.) having a number of Sichannels.

In some embodiments, the semiconductor device 100 a includes a FinFETdevice and a nanostructure GAA device stacked together. By applying thesecond inner gate spacer 620 and third inner gate spacer 1130 betweenchannels of the first device 10 and the second device 20, the channelscan be stacked together while isolated from each other. In addition, thesecond inner gate spacer 620 and third inner gate spacer 1130

further isolates the gate stacks of the first device 10 and the seconddevice 20. Moreover, the first contact 1710 and the second contact 1720of the first device 10 and the second device 20 are stacked together andisolated from each other. With this configuration, the layout area ofthe semiconductor device 100 a is reduced and the device density thereofis increased.

FIGS. 2A-2Q show perspective representations of various stages offorming a semiconductor device structure 100 b, in accordance with someembodiments of the disclosure. Some processes and materials used to formthe semiconductor device structure 100 a are similar to, or the same as,those used to form the semiconductor device structure 100 b and are notrepeated herein. The semiconductor device structure 100 b of FIG. 2Q issimilar to the semiconductor device structure 100 a of FIG. 1Q, thedifferences between FIG. 2Q and FIG. 1Q are that the first fin structure132 is made of SiGe to form the first device 10 (such as p-type FET(PFET)) in FIG. 2Q.

FIG. 2A is similar to, or the same as FIG. 1A, the first fin structure132 is formed over the first sacrificial layer 120, and thesemiconductor layer 134 is formed over the first fin structure 132.

In some embodiments, the first fin structure 132 is made of SiGe layershaving a germanium percentage lower than the germanium percentage in thefirst sacrificial layer 120. In some embodiments, the germaniumpercentage of the first fin structure 132 is in a range between about 20percent and about 30 percent. Furthermore, a difference between thegermanium percentages of the first sacrificial layer 120 and thegermanium percentage of the first fin structure 132 may be greater thanabout 20 percent or higher.

In some embodiments, the semiconductor layer 134 is made of silicon(Si). In some embodiments, the semiconductor layer 134 is made ofsilicon that is free from germanium (Ge). In some embodiments, thesemiconductor layer 134 is substantially pure silicon layers, forexample, with a germanium percentage lower than about 1 percent.Furthermore, the semiconductor layer 134 may be intrinsic, which are notdoped with p-type and n-type impurities.

Afterwards, as shown in FIG. 2B, the semiconductor strip 210 is formed,and the isolation structure 220 is formed, in accordance with someembodiments of the disclosure. Subsequently, the dummy dielectric layer230 is conformally formed to cover the semiconductor strip 210.

Next, as shown in FIG. 2C, the first dummy gate layer 310, the etch stoplayer 320 and the second dummy gate layer 330 are formed on thesemiconductor strip 210, in accordance with some embodiments of thedisclosure. Next, the patterned hard mask 340 is formed over the seconddummy gate layer 330.

Afterwards, as shown in FIG. 2D, the dummy gate stack 410 crossing thesemiconductor strip 210 is formed, and then the gate spacers 420 areformed on sidewalls of the dummy gate stack 410, in accordance with someembodiments of the disclosure.

Next, as shown in FIG. 2E, a portion of the semiconductor strip 210 andthe dummy dielectric layer 230 uncovered by the dummy gate stack 410 andthe gate spacers 420 are removed to expose the channel portion of thesemiconductor strip 210 and the top surface of the substrate 110, inaccordance with some embodiments of the disclosure. Subsequently, theinsulation layer 510 is formed on the top surface of the substrate 110.

Afterwards, as shown in FIG. 2F, the first sacrificial layer 120 and thesecond sacrificial layer 140 are removed to form the opening 122 and theopening 142, in accordance with some embodiments of the disclosure.Next, the first inner gate spacer 610 is formed in the opening 122 andthe second inner gate spacer 620 is formed in the opening 142.

Subsequently, as shown in FIGS. 2G-1 and 2G-2, the semiconductor layer134 and the semiconductor layers 152 are trimmed to form the firstsidewall spacers 710 on opposite sides of the semiconductor layer 134,and the second sidewall spacers 720 on opposite sides of thesemiconductor layers 152, in accordance with some embodiments of thedisclosure. The second inner gate spacer 620 has the top surface indirect contact with the bottom surfaces of the second sidewall spacers720 and the bottom surface in direct contact with the top surfaces ofthe first sidewall spacers 710.

It should be noted that, since the materials of the semiconductor layer134 and semiconductor layers 152 are different from the first finstructure 132 and the semiconductor layers 154, etching rates thereofare different, and the first fin structure 132 and the semiconductorlayers 154 remain in place while the semiconductor layer 134 and thesemiconductor layers 152 are trimmed.

Next, as shown in FIGS. 2H-1 and 2H-2, the first epitaxy structures 810are formed on opposite sidewalls of the first fin structure 132 and thesemiconductor layers 154, in accordance with some embodiments of thedisclosure.

Next, as shown in FIGS. 2I-1 and 2I-2, the bottom ILD 910 is formed tosurround the first epitaxy structures 810 in contact with the first finstructure 132 and exposes the first epitaxy structures 810 in contactwith the semiconductor layers 154, in accordance with some embodimentsof the disclosure. Afterwards, the etch stop layer 920 is formed on thebottom ILD 910, and the second epitaxy structures 930 are formed onopposite sidewalls of the semiconductor layers 154.

Subsequently, as shown in FIG. 2J, the top ILD 1010 is formed on theetch stop layer 920 and at least on opposite sides of the dummy gatestack 410, in accordance with some embodiments of the disclosure.

Afterwards, as shown in FIGS. 2K-1 and 2K-2, the second dummy gate layer330 and the etch stop layer 320 are patterned by using the patternedhard mask 1110 as a mask to form the trench 1120 between the gatespacers 420, in accordance with some embodiments of the disclosure. Thethird inner gate spacer 1130 is formed at least on sidewalls of thesecond dummy gate layer 330 and the etch stop layer 320 exposed by thetrench 1120.

Next, as shown in FIGS. 2L-1 and 2L-2, the remaining first dummy gatelayer 310, a portion of the dummy dielectric layer 230, and thesemiconductor layer 134 are removed to form the recess 1210, inaccordance with some embodiments of the disclosure. The first gate stack1220 is filled in the recess 1210. Since the first fin structure 132 andthe semiconductor layer 134 are made of different materials, thesemiconductor layer 134 is removed, but the first fin structure 132remains. The first gate stack 1220 wraps the first fin structure 132.

Subsequently, the processes performed on FIGS. 2M-1-2Q are the same as,or similar to the process performed on FIGS. 1M-1-1Q, and thus areomitted for brevity.

In the second embodiment, the first device 10, such as a p-type FET(PFET) is formed over the substrate 110, and the second device 20, suchas n-type FET (NFET) is formed over the first device 10. In someembodiments, the first device 10 includes a first fin structure 132having SiGe as a channel, and the second device 20 includes a number ofnanostructures (such as semiconductor layers 154) having a number of Sichannels.

FIGS. 3A-3Q show perspective representations of various stages offorming a semiconductor device structure 100 c, in accordance with someembodiments of the disclosure. Some processes and materials used to formthe semiconductor device structure 100 c are similar to, or the same as,those used to form the semiconductor device structure 100 a and are notrepeated herein.

As shown in FIG. 3A, the first semiconductor stack 130 is formed overthe first sacrificial layer 120. The first semiconductor stack 130includes the semiconductor layers 132 and the semiconductor layers 134.The second sacrificial layer 140 is formed on the first semiconductorstack 130. A second fin structure 155 is formed over the secondsacrificial layer 140. Afterwards, the patterned hard mask 160 is formedover the second fin structure 155. In some embodiments, each of thesemiconductor layers 132 is made of Si, and each of the semiconductorlayers 134 is made of SiGe.

In some embodiments, the second fin structure 155 is made of silicon(Si). In some embodiments, the second fin structure 155 is made ofsilicon that is free from germanium (Ge). In some embodiments, thesecond fin structure 155 is substantially pure silicon layers, forexample, with a germanium percentage lower than about 1 percent.Furthermore, the second fin structure 155 may be intrinsic, which arenot doped with p-type and n-type impurities.

Next, as shown in FIG. 3B, the substrate 110, the first sacrificiallayer 120, the first semiconductor stack 130, the second sacrificiallayer 140, the second fin structure 155 are patterned by using thepatterned hard mask 160 to form a semiconductor strip 210, in accordancewith some embodiments of the disclosure.

Afterwards, as shown in FIG. 3C, the first dummy gate layer 310, theetch stop layer 320 and the second dummy gate layer 330 are formed onthe semiconductor strip 210, in accordance with some embodiments of thedisclosure. Next, the patterned hard mask 340 is formed over the seconddummy gate layer 330.

Afterwards, as shown in FIG. 3D, the dummy gate stack 410 crossing thesemiconductor strip 210 is formed, and then the gate spacers 420 areformed on sidewalls of the dummy gate stack 410, in accordance with someembodiments of the disclosure.

Next, as shown in FIG. 3E, a portion of the semiconductor strip 210 andthe dummy dielectric layer 230 uncovered by the dummy gate stack 410 andthe gate spacers 420 are removed to expose the channel portion of thesemiconductor strip 210 and the top surface of the substrate 110, inaccordance with some embodiments of the disclosure. Subsequently, theinsulation layer 510 is formed on the top surface of the substrate 110.

Subsequently, as shown in FIG. 3F, the first sacrificial layer 120 andthe second sacrificial layer 140 are removed to form the opening 122 andthe opening 142, in accordance with some embodiments of the disclosure.Next, the first inner gate spacer 610 is formed in the opening 122 andthe second inner gate spacer 620 is formed in the opening 142.

Subsequently, as shown in FIGS. 3G-1 and 3G-2, the semiconductor layers134 are trimmed to form the first sidewall spacers 710 on opposite sidesof the semiconductor layer 134, in accordance with some embodiments ofthe disclosure.

It should be noted that, since the materials of the semiconductor layers134 are different from the second fin structure 155 and thesemiconductor layers 132, etching rates thereof are different, and thesecond fin structure 155 and the semiconductor layers 132 remain inplace while the semiconductor layers 134 are trimmed.

Next, as shown in FIGS. 3H-1 and 3H-2, the first epitaxy structures 810are formed on opposite sidewalls of the semiconductor layers 132 and thesecond fin structure 155, in accordance with some embodiments of thedisclosure. It should be noted that, since the first epitaxy structures810 are not in direct contact with the first sidewall spacers 710, andtherefore there is an air space 811 between the first epitaxy structures810 and the first sidewall spacers 710.

Next, as shown in FIGS. 3I-1 and 3I-2, the bottom ILD 910 is formed tosurround the first epitaxy structures 810 in contact with thesemiconductor layers 134 and exposes the first epitaxy structures 810 incontact with the second fin structure 155, in accordance with someembodiments of the disclosure. Afterwards, the etch stop layer 920 isformed on the bottom ILD 910, and the second epitaxy structures 930 areformed on opposite sidewalls of the second fin structure 155.

Subsequently, as shown in FIG. 3J, the top ILD 1010 is formed on theetch stop layer 920 and at least on opposite sides of the dummy gatestack 410, in accordance with some embodiments of the disclosure.

Afterwards, as shown in FIGS. 3K-1 and 3K-2, the second dummy gate layer330 and the etch stop layer 320 are patterned by using the patternedhard mask 1110 as a mask to form the trench 1120 between the gatespacers 420, in accordance with some embodiments of the disclosure. Thethird inner gate spacer 1130 is formed at least on sidewalls of thesecond dummy gate layer 330 and the etch stop layer 320 exposed by thetrench 1120.

Next, as shown in FIGS. 3L-1 and 3L-2, the remaining first dummy gatelayer 310, a portion of the dummy dielectric layer 230, and thesemiconductor layer 132 are removed to form the recess 1210, inaccordance with some embodiments of the disclosure. The first gate stack1220 is filled in the recess 1210. Since the semiconductor layers 132and the semiconductor layers 134 are made of different materials, thesemiconductor layers 134 are removed, but the semiconductor layers 132remain. The first gate stack 1220 wraps the semiconductor layers 132.

Afterwards, as shown in FIGS. 3M-1 and 3M-2, the remaining second dummygate layer 330 and the remaining dummy dielectric layer 230 are removedto form the recess 1310, in accordance with some embodiments of thedisclosure. As a result, the second fin structure 155 is exposed. Next,the second gate stack 1320 is formed and/or filled in the recess 1310.Therefore, the second gate stack 1320 encircles (wraps) the second finstructure 155 and is formed over the first gate stack 1220. In someembodiments, the second fin structure 155 is in direct contact with thesecond gate stack 1320.

As shown in FIGS. 3M-1 and 3M-2, the first gate stack 1220 is a n-typemetal gate stack, and the second gate stack 1320 is an p-type metal gatestack. In some other embodiments, the first gate stack 1220 is an p-typemetal gate stack, and the second gate stack 1320 is a n-type metal gatestack.

As shown in FIGS. 3M-1 and 3M-2, the semiconductor layers 132, the firstepitaxy structures 810, and the first gate stack 1220 form the firstdevice 10, such as an n-type FET (NFET). The second fin structure 155,the second epitaxy structures 930, and the second gate stack 1320 formthe second device 20, such as a p-type FET (PFET). The first device 10has a horizontal-gate-all-around (HGAA) device, structure and the seconddevice 20 has a FinFET device. Therefore, the first device 10 and thesecond device 20 are stacked on the substrate 110, and the first device10 is disposed between the second device 20 and the substrate 110.

Subsequently, the processes performed on FIGS. 3N-3Q are the same as, orsimilar to the process performed on FIGS. 1N-1-1Q, and thus are omittedfor brevity.

In the third embodiment, the first device 10, such as a n-type FET(NFET) is formed over the substrate 110, and the second device 20, suchas p-type FET (PFET) is formed over the first device 10. In someembodiments, the first device 10 includes a number of nanostructures (orcalled nanowires, nanosheets) having a number of Si channels, and thesecond device 20 includes the second fin structure 155 having Si as achannel. In some other embodiments, the first device 10 includes anumber of nanostructures (nanowires) having a number of Si channels, andthe second device 20 includes the second fin structure having SiGe as achannel.

FIGS. 4A-4Q show perspective representations of various stages offorming a semiconductor device structure 100 d, in accordance with someembodiments of the disclosure. Some processes and materials used to formthe semiconductor device structure 100 d are similar to, or the same as,those used to form the semiconductor device structure 100 c and are notrepeated herein.

As shown in FIG. 4A, the first semiconductor stack 130 is formed overthe first sacrificial layer 120, the second semiconductor stack 150 isformed over the second sacrificial layer 140. The second semiconductorstack 150 includes the semiconductor layer 152 and the semiconductorlayer 154.

In some embodiments, the semiconductor layer 152 is made of SiGe, andthe semiconductor layer 154 is made of Si. In some embodiments, thethickness of the semiconductor layer 152 is smaller than thesemiconductor layer 154.

Afterwards, as shown in FIG. 4B, the substrate 110, the firstsacrificial layer 120, the first semiconductor stack 130, the secondsacrificial layer 140, the second semiconductor stack 150 are patternedby using the patterned hard mask 160 to form the semiconductor strip210, in accordance with some embodiments of the disclosure.

Afterwards, as shown in FIG. 4C, the first dummy gate layer 310, theetch stop layer 320 and the second dummy gate layer 330 are formed onthe semiconductor strip 210, in accordance with some embodiments of thedisclosure. Next, the patterned hard mask 340 is formed over the seconddummy gate layer 330.

Afterwards, as shown in FIG. 4D, the dummy gate stack 410 crossing thesemiconductor strip 210 is formed, and then the gate spacers 420 areformed on sidewalls of the dummy gate stack 410, in accordance with someembodiments of the disclosure.

Next, as shown in FIG. 4E, a portion of the semiconductor strip 210 andthe dummy dielectric layer 230 uncovered by the dummy gate stack 410 andthe gate spacers 420 are removed to expose the channel portion of thesemiconductor strip 210 and the top surface of the substrate 110, inaccordance with some embodiments of the disclosure. Subsequently, theinsulation layer 510 is formed on the top surface of the substrate 110.

Subsequently, as shown in FIG. 4F, the first sacrificial layer 120 andthe second sacrificial layer 140 are removed to form the opening 122 andthe opening 142, in accordance with some embodiments of the disclosure.Next, the first inner gate spacer 610 is formed in the opening 122 andthe second inner gate spacer 620 is formed in the opening 142.

Subsequently, as shown in FIGS. 4G-1 and 4G-2, the semiconductor layers134 are trimmed to form the first sidewall spacers 710 on opposite sidesof the semiconductor layer 134, the semiconductor layers 152 is trimmedto form the second sidewall spacer 720 below the semiconductor layer154, in accordance with some embodiments of the disclosure.

It should be noted that, since the materials of the semiconductor layer152 and semiconductor layers 134 are different from the semiconductor154 and the semiconductor layers 132, etching rates thereof aredifferent, and the semiconductor layer 154 and the semiconductor layers132 remain in place while the semiconductor layer 152 and thesemiconductor layers 134 and are trimmed.

Next, as shown in FIGS. 4H-1 and 4H-2, the first epitaxy structures 810are formed on opposite sidewalls of the semiconductor layers 132 and thesemiconductor layer 154, in accordance with some embodiments of thedisclosure.

Next, as shown in FIGS. 4I-1 and 4I-2, the bottom ILD 910 is formed tosurround the first epitaxy structures 810 in contact with thesemiconductor layers 132 and exposes the first epitaxy structures 810 incontact with the second fin structure 155, in accordance with someembodiments of the disclosure. Afterwards, the etch stop layer 920 isformed on the bottom ILD 910, and the second epitaxy structures 930 areformed on opposite sidewalls of the second fin structure 155.

Subsequently, as shown in FIG. 4J, the top ILD 1010 is formed on theetch stop layer 920 and at least on opposite sides of the dummy gatestack 410, in accordance with some embodiments of the disclosure.

Afterwards, as shown in FIGS. 4K-1 and 4K-2, the second dummy gate layer330 and the etch stop layer 320 are patterned using the patterned hardmask 1110 as a mask to form the trench 1120 between the gate spacers420, in accordance with some embodiments of the disclosure. The thirdinner gate spacer 1130 is formed at least on sidewalls of the seconddummy gate layer 330 and the etch stop layer 320 exposed by the trench1120.

Next, as shown in FIGS. 4L-1 and 4L-2, the remaining first dummy gatelayer 310, a portion of the dummy dielectric layer 230, and thesemiconductor layer 134 are removed to form the recess 1210, inaccordance with some embodiments of the disclosure. The first gate stack1220 is filled in the recess 1210.

Afterwards, as shown in FIGS. 4M-1 and 4M-2, the remaining second dummygate layer 330, the remaining dummy dielectric layer 230, and thesemiconductor layer 152 are removed to are removed to form the recess1310, in accordance with some embodiments of the disclosure. As aresult, the semiconductor layer 154 is exposed. Next, the second gatestack 1320 is formed and/or filled in the recess 1310. Therefore, thesecond gate stack 1320 encircles (wraps) the semiconductor layer 154 andis formed over the first gate stack 1220.

As shown in FIGS. 4M-1 and 4M-2, the first gate stack 1220 is a n-typemetal gate stack, and the second gate stack 1320 is an p-type metal gatestack. In some other embodiments, the first gate stack 1220 is an p-typemetal gate stack, and the second gate stack 1320 is a n-type metal gatestack.

As shown in FIGS. 4M-1 and 4M-2, the semiconductor layers 132, the firstepitaxy structures 810, and the first gate stack 1220 form the firstdevice 10, such as an n-type FET (NFET). The semiconductor layer 154,the second epitaxy structures 930, and the second gate stack 1320 formthe second device 20, such as a p-type FET (PFET). The first device 10has a horizontal-gate-all-around (HGAA) device, and the second device 20also has a horizontal-gate-all-around (HGAA) device. Therefore, thefirst device 10 and the second device 20 are stacked on the substrate110, and the first device 10 is disposed between the second device 20and the substrate 110.

Subsequently, the processes performed on FIGS. 4N-4Q are the same as, orsimilar to the process performed on FIGS. 3N-1-3Q, and thus are omittedfor brevity.

In the fourth embodiment, the first device 10, such as a n-type FET(NFET) is formed over the substrate 110, and the second device 20, suchas p-type FET (PFET) is formed over the first device 10. In someembodiments, the first device 10 includes a number of nanostructures (orcalled nanowires or nanosheets) having a number of Si channels, and thesecond device 20 includes a nanostructure (or called nanowire ornanosheet) having a Si channel. In some other embodiments, the firstdevice 10 includes a number of nanostructures (or called nanowires ornanosheets) having a number of Si channels, and the second device 20includes a nanostructure (nanowire) having a SiGe channel.

Embodiments for forming a semiconductor device structure and method forformation the same are provided. The FinFET device and the GAA deviceare stacked in a vertical direction. The FinFET device and the GAAdevice are isolated from each other by inner gate spacers. By thisdesign, the layout area of the semiconductor device is reduced and thedevice density thereof is increased.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a first device formed over asubstrate, and the first device comprises a first fin structure. Thesemiconductor device structure also includes a second device formed overor below the first device, and the second device comprises a pluralityof second nanostructures stacked in a vertical direction.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a first device formed over asubstrate, and the first device comprises a first fin structure. Thesemiconductor device structure includes a first gate stack wrappedaround the first fin structure, and a second device formed over thefirst device. The second device includes a plurality of secondnanostructures stacked in a vertical direction. The semiconductor devicestructure includes a second gate stack wrapped around the secondnanostructures, and a topmost surface of the first gate stack is higherthan a bottom surface of the second gate stack.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a plurality of firstnanostructures formed over a substrate, and the first nanostructuresstacked in a vertical direction. The semiconductor device structure alsoincludes a first gate stack wrapped around the first nanostructures, anda first inner gate spacer formed over the first nanostructures. Thesemiconductor device structure further includes a second fin structureformed over the first inner gate spacer, and a second gate stack wrappedaround the second fin structure.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor device structure, comprising: afirst device formed over a substrate, wherein the first device comprisesa first fin structure; and a second device formed over or below thefirst device, wherein the second device comprises a plurality of secondnanostructures stacked in a vertical direction.
 2. The semiconductordevice structure as claimed in claim 1, wherein one of the first deviceand the second device is a P-type device and the other is an N-typedevice.
 3. The semiconductor device structure as claimed in claim 1,further comprising: a first gate stack wrapped around the first finstructure; and a second gate stack wrapped around the secondnanostructures.
 4. The semiconductor device structure as claimed inclaim 3, further comprising: an inner gate spacer between the first gatestack and the second gate stack.
 5. The semiconductor device structureas claimed in claim 3, wherein the first gate stack comprises a firstportion and a second portion, the first portion is next to a sidewall ofthe second gate stack, and the second portion is directly below thesecond gate stack.
 6. The semiconductor device structure as claimed inclaim 1, further comprising: an isolation structure formed over thesubstrate; and an inner gate spacer extended above the substrate,wherein a top surface of the inner gate spacer is higher than a topsurface of the isolation structure.
 7. The semiconductor devicestructure as claimed in claim 1, further comprising: a sidewall spacerbetween two adjacent second nanostructures; a second S/D structureformed on a sidewall of one of the second nanostructures; and a secondgate stack wrapped around the second nanostructures, wherein thesidewall spacer is between the second gate stack and the second S/Dstructure.
 8. The semiconductor device structure as claimed in claim 7,further comprising: a first S/D structure formed on a sidewall of thefirst fin structure; and an etch stop layer between the first S/Dstructure and the second S/D structure.
 9. The semiconductor devicestructure as claimed in claim 1, wherein one of the first device and thesecond device is a logic circuit device, and the other is the staticrandom access memory (SRAM).
 10. A semiconductor device structure,comprising: a first device formed over a substrate, wherein the firstdevice comprises a first fin structure; a first gate stack wrappedaround the first fin structure; a second device formed over the firstdevice, wherein the second device comprises a plurality of secondnanostructures stacked in a vertical direction; and a second gate stackwrapped around the second nanostructures, wherein a topmost surface ofthe first gate stack is higher than a bottom surface of the second gatestack.
 11. The semiconductor device structure as claimed in claim 10,further comprising: a sidewall spacer formed between two adjacent secondnanostructures; and an S/D structure formed on a sidewall of one of thesecond nanostructures; and a second gate stack wrapped around the secondnanostructures, wherein the sidewall spacer is between the second gatestack and the S/D structure.
 12. The semiconductor device structure asclaimed in claim 10, further comprising: an etch stop layer between thefirst gate stack and the second gate stack.
 13. The semiconductor devicestructure as claimed in claim 10, wherein one of the first device andthe second device is a logic circuit device, and the other is the staticrandom access memory (SRAM).
 14. The semiconductor device structure asclaimed in claim 10, wherein one of the first device and the seconddevice is a P-type device and the other is an N-type device.
 15. Themethod for forming the semiconductor device structure as claimed inclaim 10, further comprising: an inner gate spacer between the firstgate stack and the second gate stack, wherein the inner gate spacercomprises a top surface in direct contact with the second gate stack anda bottom surface in direct contact with the first gate stack.
 16. Asemiconductor device structure, comprising: a plurality of firstnanostructures formed over a substrate, wherein the first nanostructuresare stacked in a vertical direction; a first gate stack wrapped aroundthe first nanostructures; a first inner gate spacer formed over thefirst nanostructures; a second fin structure formed over the first innergate spacer; and a second gate stack wrapped around the second finstructure.
 17. The semiconductor device structure as claimed in claim16, wherein the second fin structure is in direct contact with the firstinner gate spacer.
 18. The semiconductor device structure as claimed inclaim 16, wherein the first gate stack comprises a first portion and asecond portion, the first portion is next to a sidewall of the secondgate stack, and the second portion is directly below the second gatestack.
 19. The semiconductor device structure as claimed in claim 18,further comprising: a second inner gate spacer between the first portionof the first gate stack and the second gate stack.
 20. The semiconductordevice structure as claimed in claim 16, wherein the first gate stackhas a first thickness, the second gate stack has a second thickness, andthe second thickness is smaller than the first thickness.